A New Paradigm in Test and Measurement

CM300xi uses Contact Intelligence™
to sense, learn and react automatically

Contact Intelligence™ Technology
Transforming 300 mm Probing

Accelerate your measurement cycle and improve yields with unprecedented levels of performance.

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Accurate Probe-to-Pad Alignment

Precise probe placement on pads as small as 30 um x 30 um, and bumps down to 25 um.

Contact Intelligence technology includes on-axis probe needle tracking capability to deliver precise probe placement on pads as small as 30 um x 30 um, and bumps down to 25 um. Automatically maintain consistency across multiple temperatures, holding low-current leakage and noise to an absolute minimum for ultimate accuracy.

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Extended Thermal Range

Achieve consistently accurate measurements across a wide temperature spectrum (from -60° C to 300° C)

The CM300xi High Temperature Stability system employs a heat-tolerant platen, microscope transport and probe card holder, all controlled by VueTrack software, to maintain probe-to-pad alignment over a wide temperature range.

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Unattended Test

Accelerate the pace of wafer-level test with new methods of automation for gathering large volumes of measurement data.

A full suite of automation features compensate for thermal drift while moving with maximum efficiency from one temperature set point to the next. Automatic wafer loading allows entire test cycles to be conducted unattended, delivering more data in less time than ever.

Put Contact Intelligence to Work for Your Application.

Address Emerging Test Challenges with the Flexible Architecture of CM300xi

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Device Characterization

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Niche Production

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High-Volume Engineering

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Custom Solutions

Select Your Level of Automation

Each Option Offers Unique Advantages

SEMI-AUTOMATED

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CM300xi: Semi-Automated

Scalable from semi-automated operation to fully-automated or dual-prober system.

  1. Contact Intelligence technology minimizes user intervention during test over a very wide temperature range.
  2. Velox™ probe station control software enables easy integration with instruments, probe stations, and test and measurement software for fast data collection.
  3. EMI-shielded test environment enables accurate and easy over temperature measurements and low-leakage/low-noise measurements.
  4. Thermal chuck with extended temperature range of -60˚C to 300˚C.
  5. Mechanical accuracy for reliable measurement results on small pads and fine pitches.

FULLY-AUTOMATED

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CM300xi: Fully-Automated

Scalable from semi-automated operation to fully-automated or dual-prober system.

  1. Contact Intelligence technology minimizes user intervention during test over a very wide temperature range.
  2. Velox™ probe station control software enables easy integration with instruments, probe stations, and test and measurement software for fast data collection.
  3. EMI-shielded test environment enables accurate and easy over-temperature measurements and low-leakage/low-noise measurements.
  4. Thermal chuck with extended temperature range of -60˚C to 300˚C.
  5. Mechanical accuracy for reliable measurement results on small pads and fine pitches.
  6. One or two load ports for capacity up to 50 wafers for extended hours of unattended test and higher efficiency.

DUAL-PROBER

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CM300xi: Dual-Prober

Dual-probe configuration includes two independent prober systems that share a single material handling unit to increase test cell efficiency and minimize footprint.

  1. Contact Intelligence technology minimizes user intervention during test over a very wide temperature range
  2. Velox™ probe station control software enables easy integration with instruments, probe stations, and test and measurement software for fast data collection.
  3. EMI-shielded test environment enables accurate and easy over-temperature measurements and low-leakage/low-noise measurements.
  4. Thermal chuck with extended temperature range of -60˚C to 300˚C.
  5. Mechanical accuracy and stability for reliable measurement results on small pads and fine pitches.
  6. Parallel test of wafers with different test set-ups on the two probers.
  7. Parallel testing of wafers at different temperatures without chuck temperature ramp.
  8. Scalable from semi-automated operation to fully-automated or dual-prober system.